IEC 61189-5-601 pdf – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
9.2Specimen preparation
The surface to be tested shall be in the “as received” condition and needs to be shielded fromany kind of contamination, and the specimen shall not be subsequently touched by fingers.9.3Pre-process
9.3.1 Pre-conditioning
When the product specification indicates that the pre-conditioning be a moisture treatment, thispre-conditioning should be carried out in accordance with the specified conditions.
9.3.2Initial measurement
The initial measurement should be carried out by visual inspection of the test substratespecimen, magnified 10×.The following checks should be carried out:
. substrate curving or warping (out of product specifications);
substrate cracking or delamination;
solder resist stripping;
land is lacking or stripping;adhesion of a foreign object.9.3.3 Moistening process (1)
The test substrate specimen should be moistened using the pre-conditioning equipmentspecified in 6.1 under the conditions as specified in the product specification.
9.3.4 Baking and warp correction
The test substrate specimen should be baked using the pre-conditioning equipment specifiedin 6.1 under the conditions as specified in the product specification.
lf specified in the product specification, weight shall be put on the test substrate specimen tocorrect the warp.
The weight shall be specified in the product specification.9.4 Reflow heating
Using the reflow soldering equipment specified in 6.2 d), heat up the test substrate in thecondition specified in the product specification.Reflow times shall be specified in the product
specification. Then,the surface temperature of the printed board should be measured in thecentre of the device-mounting area on the test substrate.
The test substrate shall be heated up to the maximum temperature and for the time of reflowsoldering profile in Figure 10, Figure 11,Figure 12 and Table 4.
9.5 Final measurement
The final measurement shall be carried out by visual inspection of the test substrate, magnifying10×.The following items should be checked.
.substrate curving or warping (out of product specifications);
substrate cracking or delamination;
solder resist stripping;
land is lacking or stripping;swelling of the substrate.
Then, using X-ray transmission equipment, check the soldered condition. If necessary, observethe cross-sectional view after the casting process in a resin.
10 Tg4 Wetting and dewetting of a printed-board land
10.1General
Test Tg4 provides the test method for the wetting and dewetting of a printed-board land asshown in Figure 19.
10.2 Specimen preparation
The surface to be tested shall be in the “as received” condition and needs to be shielded from any kind of contamination, and the printed-board land shall not be subsequently touched by
fingers.
10.3 Pre-process
10.3.1 Pre-conditioning
When the product specification indicates that the pre-conditioning be a moisture treatment, this pre-conditioning should be carried out in accordance with the specified conditions.
10.3.2Initial measurement
The initial visual inspection shall be carried out on the package to verify that there is no apparentdamage, by magnifying it 10×,
.substrate curving or warping (out of product specifications);- substrate cracking or delamination;
stripping of solder resist;
.land is lacking or stripping;.adhesion of a foreign object.10.3.3 Moistening process (1)
The test substrate specimen should be moistened using the pre-conditioning equipmentspecified in 6.1 under the conditions as specified in the product specification.
10.3.4 Pre-baking
The test substrate specimen should be baked using the pre-conditioning equipment specifiedin 6.1 under the conditions as specified in the product specification.
10.3.5 Pre-reflow heating
Using the reflow soldering equipment specified in 6.2 d), heat up the test substrate in thecondition specified in the product specification. Then, the surface temperature of the printedboard should be measured in the centre of the device-mounting area on the test substrate.
The test substrate shall be heated up to the maximum temperature and for the time of reflowsoldering profile in Figure 10,Figure 11,Figure 12 and Table 4.
10.3.6 Moistening process (2)
When the test substrate is subjected to the reflow process twice, the test substrate should bemoistened once again under the conditions as specified in the product specification.
10.4Assembly process
10.4.1Solder paste printing
Using the stencil described in 6.2 a), print the solder paste as described in 5.3 so that there isno area that is intended to have solder paste applied to it that is free of paste, and there is noexuding or bridging of the paste on to the test substrate.
10.4.2Reflow heating
Using the reflow soldering equipment specified in 6.2 d), heat the test substrate in the conditionspecified in the product specification. Then, the surface temperature of the printed board shouldbe measured in the centre of device-mounting area on the test substrate.
The test substrate shall be heated using the minimum temperature of the reflow soldering profilein Table 5.